国家/地区 韩国（3） 世界知识产权组织（3）
IPC部 C（7） H（4）
IPC大类 C09（7）
IPC小类 C09J（7） H05K（3）
IPC C09J201/00（7）
发明人 DAISUKE T（3） GINJI M（3） TOMOHARU K（3）
CHOI S（2） KIMTAEHAN（2） SHIM Y（2）
SONG J（2） YUMINSOOK（2）
公开年 2023（7）
申请年 2021（3）  2022（3） 
专利权人 NITTO DENKO .（3） PURE MANN IN.（2）

Polar ear glue structure useful in battery, comprises pole ear glue main body comprising pole ear glue core film layer, where upper and lower sides of pole ear film layer are symmetrically provided with glue layer, and polypropylene connecting layer provided on side of glue-proof layer.

HE S, YI H, LIU W

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet e.g. for mobile terminals such as smart phones, and video cameras, and joined body, comprises polymer and ionic liquid, where polymer as base polymer and further comprising another polymer.

DAISUKE T, GINJI M, TOMOHARU K

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet and joined body, where adhesive sheet used for e.g. mobile terminals such as smartphones, comprises polymer, ionic liquid, and tackifier.

TOMOHARU K, GINJI M, DAISUKE T

Pressure-sensitive adhesive composition used for electrical peeling and in pressure-sensitive adhesive sheet and joined body, where adhesive sheet used for e.g. mobile terminals such as smartphones, comprises polymer, ionic liquid, and tackifier having specific hydroxyl value.

TOMOHARU K, GINJI M, DAISUKE T

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y