国家/地区 中国（9） 美国（2）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08J（11）
IPC C09K005/14（11）
发明人 CHEN C（2） CHEN J（2） WANG D（2）
YANG L（2） ZHAO J（2） ZHAO X（2）
ZHOU H（2）
公开年 2023（11）
申请年 2022（7）  2021（2）  2023（2） 
专利权人 UNIV JILIN（2）

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W