国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（4）
IPC小类 C25D（4） C08J（3） C08L（3）
C09D（3）
IPC C25D005/56（4）
发明人 SHAO Z（2） SUN J（2） WU B（2）
ZHENG N（2）
公开年 2023（4）
申请年 2022（2） 
专利权人 TAN KAH KEE .（2） UNIV XIAMEN（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K