国家/地区 中国（136）
IPC部 C（136）
IPC大类 C09（136） C08（63） C01（28）
H05（23） H01（15） B32（9）
B01（4） B29（4） C02（4）
C04（3） C07（3） C23（3）
D01（3） B22（2）
IPC小类 C09K（136）
IPC C09K005/14（136）
发明人 LIU Y（9） WANG J（7） YANG S（7）
WU X（6） ZHANG J（6） ZHANG Z（6）
CHEN J（5） GE X（5） HU J（5）
LI C（5） LI Z（5） PAN Z（5）
XU Z（5） ZHANG X（5） ZHOU M（5）
公开年 2022（88） 2023（48）
申请年 2022（136）
专利权人 HANGZHOU FUX.（8） ANHUI AEROSP.（5） UNIV GUANGDO.（4） UNIV BEIJING.（3）
ANHUI TANHUA.（2） BEIJING JONE.（2） BEIJING ZHON.（2） CETC NO 33 I.（2）
CHANGZHOU WI.（2） DONGGUAN JIA.（2） GUANGDONG MO.（2） HANGZHOU REL.（2）
NEW MORE GRA.（2） SHANDONG HAI.（2） SHENZHEN HFC.（2） STATE GRID C.（2）
UNIV CHANGZH.（2） UNIV HUNAN（2） UNIV SOUTH C.（2） UNIV TSINGHU.（2）

Coating structure based on high graphene-conducting radiating network powder coating, has metal heat conducting layers whose upper surfaces are provided with rectangular connecting through holes.

PU G, WANG H, YE Y

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Flexible high thermal conductivity graphite material useful as a heat dissipation material in electronics, communications, medical, aerospace, and high-end equipment, has sheet structure.

PEI X, XU W, LI M, XU C, CHEN W, CHEN Y, CHEN J

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Graphene-based enhanced heat conducting sheet, comprises graphene heat conduction sheet substrate, reinforcing body and connecting layer.

SUN H, ZHOU B, TANG Z, LI F

Preparation of titanium carbide MXene/reduced graphene oxide/gold-copper nanoparticle aerogel for electrothermal and photothermal device, involves preparing gold-copper nanoparticle powder, adding to MXene/graphene oxide mixed solution, adding ascorbic acid, stirring, and heating obtained precursor.

YIN S, QIAO H, QIN W

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X

Flexible graphite composite heat-conducting film, comprises a laminated graphite layer and an adhesive layer.

WAN P, HAO L, TANG Z, TAO X, ZHOU B

Processing of high thermal conductivity nano composite material for refrigeration, involves using complexing product of particle artificial diamond powder, large particle artificial diamond powder, silver powder, hydrogen iodide solution, and pure aluminum block.

SUN K, LIU H, LIU Q, MA R, PAN Q

Organic silicone adhesive used for preparing thermally conductive phase change material, comprises dihydroxy polydimethylsiloxane, epoxy group-containing siloxane, crosslinking agent, and modified graphene oxide which is graphene oxide modified with surface modifier.

YANG Z, ZHANG X