国家/地区 中国（6）
IPC部 B（6）
IPC大类 B23（6） H01（3） C09（2）
IPC小类 B23K（6） C09D（2） H01B（2）
IPC B23K020/02（6）
发明人 LIU W（2） SUN S（2） WANG J（2）
YANG M（2） ZHANG Q（2） ZHANG X（2）
ZHOU J（2）
公开年 2022（4）
申请年 2017（2）  2021（2）  2022（2） 
专利权人 SHENZHEN XIN.（2） UNIV LANZHOU（2）

Preparing graphene-reinforced foam metal preformed sheet useful in e.g. electronic packaging field, comprises e.g. placing foam metal in reaction chamber, introducing carbon source gas and reducing gas, heating obtain metal attached with graphene, and placing tin-based metal foils.

YANG M, SUN S

Method for preparing graphene reinforced tin-based composite solder, involves mixing graphene-copper composite material, tin-based metal particles and organic carrier to obtain graphene reinforced tin-based composite solder.

YANG M, SUN S

Hybrid bonding structure for use in semiconductor device, comprises core and shell configured to form intermetallic compound in response to transient liquid phase.

LEE J, SONG B, CHU K, CHU K M, JUNGHOON L, LI Z, JOO G

Hot press for producing graphene carbon crystal heating plate, has middle carrier plate whose side surface is provided with side groove, where inner surface of side groove is movably sleeved with compensation plate.

ZHANG Y

Graphene-containing Yttrium barium copper oxide coating conductor welding joint, comprises welding layer located at both sides, where Yttrium barium copper oxide comprises copper layer, silver layer, Hastelloy alloy layer, buffer layer.

ZHANG X, WANG J, ZHANG Q, LIU W, ZHOU J

Preparing graphene containing yttrium barium copper oxide coating conductor welding joint comprises e.g. adding graphene powder in solder paste, by mechanical stirring and ultrasonically mixing graphene powder and dispersing in solder paste.

ZHANG X, WANG J, ZHANG Q, LIU W, ZHOU J