国家/地区 中国（6）
IPC部 B（6） C（3）
IPC大类 B24（6） C09（2）
IPC小类 B24D（6） B24B（3） C09D（2）
IPC B24D018/00（6）
发明人
公开年 2022（3） 2023（3）
申请年 2022（6）
专利权人

Preparing high abrasion resistance chemical mechanical polishing pad used for production of semiconductor chips, by mechanically dispersing filler and surfactant in organic solvent to obtain dispersion, adding resin solution to dispersion, stirring and coating on transparent film coiled material.

YAO L, CHEN H, XIANG H

Grinding pad useful for photo-catalytic auxiliary chemical mechanical polishing, comprises grinding layer and backing layer, comprising liquid resin bonding agent, reactive diluent, grinding material, filler, photocatalyst, curing agent, initiator and other auxiliary agent.

ZHAO Y, DING Y, QIN F

High performance grinding wheel for titanium alloy cutting, comprises cubic boron nitride, liquid phenolic resin, epoxy resin adhesive, cryolite, aluminum oxide, lanthanum element, cerium element, diamond graphene powder.

XU T, WENG C, WEI Q, LI X

Hardening method of superfine steel ball grinding abrasive tool comprises spraying adhesion layer material, grinding layer material and abrasive sizing agent on abrasive tool surface, cleaning the surface of the abrasive body by ultrasonic waves and subjecting to a roughening treatment.

TANG X, WANG X, WANG H, SUN Q, SHI L, ZHANG Y

Fine polishing pad for inner wall of new energy automobile cylinder in chemical mechanical planarization process, comprises polyurethane prepolymer, diluent, chain extender, foaming agent, grinding material and filler, fine grinding pad is prepared by mixing and stirring polyurethane prepolymer.

LI Y, YANG H, LIANG Z, HUANG G, LI J

Processing-hardness brazing diamond grinding wheel comprises e.g. putting in sodium hydroxide solution to soak and remove oil deionized water ultrasonic cleaning to neutral, and putting in nitric acid solution to coarsen.

SHEN M, YAN Z