国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08L063/00（7）
发明人 LIN K（2）
公开年 2020（4） 2021（3）
申请年 2020（7）
专利权人 LIN K（2）

Toughening modification of ultra-low temperature epoxy resin involves preparing graphene oxide/nano cellulose solution, adding e.g. diethylenetriamine, epoxy resin and curing agent, mixing and casting in mold and vacuum defoaming.

JIAO W, YAN M, WANG R, HE X

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M

Graphene/epoxy resin composite material based on lamellar anisotropy is obtained by carrying out controllable compression on graphene aerogel, then mixing with epoxy resin, and curing.

LI X, LIU P, CHANG X, MIN P, SHU C, LI Y, YU Z

Polyethyleneimine flame-retardant curing agent modified epoxy resin comprises epoxy resin, graphene-cyclotriphosphazene grafted polyethyleneimine, curing accelerator, defoamer and leveling agent.

LIN K

Graphene-anhydride curing agent modified waterborne epoxy resin material comprises functionalized graphene, methacrylic acid, methyl acrylate, hydroxypropyl acrylate, maleic anhydride, initiator, and epoxy resin.

LIN K

Preparing graphene oxide modified epoxy resin by adopting hummers to prepare graphene oxide slurry, diluting slurry with water, centrifuging, adding dimethylformamide, dripping epoxy resin, adding polyetheramine to liquid, and curing.

CAI J, ZHAO L, XIAO W