国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8） C09（2）
IPC小类 C08G（8）
IPC C08L063/00（8）
发明人 WANG L（2）
公开年 2021（8）
申请年 2021（5）  2020（3） 
专利权人

Preparing epoxy resin composite material comprises mixing dopamine-modified graphene oxide, multifunctional epoxy resin, curing agent and polar organic solvent, and curing.

ZHU S, LI Y, WANG L, LI Z, JIANG H

Bio-based nano-synergistic flame retardant used in polymer composite material e.g. epoxy resin composite material, comprises two-dimensional material, transition metal organic framework intercalated in material, and phytic acid wrapped outside organic framework.

GONG K, ZHOU K, YIN L

Preparation of polydopamine nano-layer-coated graphene oxide filled epoxy resin composite material involves preparing natural flake graphite into graphene oxide, self-polymerizing polydopamine to coat graphene oxide, coating graphene oxide-filled epoxy resin with polydopamine nanolayers.

ZHENG F, LIU Y, ZHOU H, WANG Y, DU G, LI G, YANG J

Composition useful as matrix in composite materials, comprises a polyfunctional cyanate ester, an asymmetric bisphenol-derived cyanate ester, and substituted heterocyclic compounds.

HAMERTON I, TSIAMIS A, ZIAMES A, HAMMERTON I

Lignin derivative-based phosphorus-containing epoxy resin used for forming composite material for flame retardant materials, coatings, microelectronic packaging materials, and adhesives, comprises structures.

YANG W, DING H, MA P, XU P

Toughening modification of ultra-low temperature epoxy resin involves preparing graphene oxide/nano cellulose solution, adding e.g. diethylenetriamine, epoxy resin and curing agent, mixing and casting in mold and vacuum defoaming.

JIAO W, YAN M, WANG R, HE X

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M