国家/地区 中国（9）
IPC部 C（9）
IPC大类 C08（9） H05（7） B32（3）
C09（3） H01（3）
IPC小类 C08L（9）
IPC C08L063/00（9）
发明人 CHEN K（2） YU D（2）
公开年 2022（9）
申请年 2022（4）  2021（3）  2020（2） 
专利权人 ITEQ WUXI EL.（2）

Preparation of high-thermal-conductivity graphene/epoxy resin composite material used as electronic packaging material, involves preparing graphene hydrogel, freezing to obtain graphene aerogel, pre-reducing under argon protection, and soaking in mixed solution of epoxy resin and curing agent.

WANG X, MA Z, ZHANG H

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Preparing a electric response shape memory composite material useful in electric drive shape memory polymer material low resistor and high stability, comprises e.g. taking shape memory polymer solution/prepolymer solution, dispersing and forming uniform conductive slurry and coating into groove mold.

LIU Y, ZHANG F, HU R, LENG J

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

preparing graphene electromagnetic shielding composite material comprises preparing multilayer graphene nanosheet powders using highly oriented pyrolytic graphite, dispersing with polymer matrix material, preparing into nanosheets oriented in solution, and curing.

QI Y, TONG X, WANG Z, LIN F, ZHOU C

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Composite material useful in electromagnetic shielding device, comprises carbon fiber base layer surface loaded with bonding layer surface formed with modified graphene oxide material layer.

SUN L, TIAN Y, MA H, LIU S, MA X