国家/地区 中国（5）
IPC部 C（5）
IPC大类 C22（5） C23（2） C25（2）
IPC小类 C22F（5） C22C（2） C23C（2）
C25D（2）
IPC C22F001/08（5）
发明人 LIU K（5）
公开年 2021（4）
申请年 2021（4） 
专利权人 SONGSHAN LAK.（3） NANCHANG INS.（2） ZHONGKE JING.（2）

Preparing copper-based graphene composite material comprises growing graphene film on surface of copper foil by chemical vapor deposition, stacking, using ultrasonic welding technology to weld stacked components, and removing stress and annealing welded stack assembly.

WANG E, WANG X, HE M, ZHANG R, ZHAO C, HU X, LIU K, FU Y

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Preparation of deformable high-conductivity copper-iron composite material involves ball milling graphene, iron powder, and copper powder, adding melted electrolytic copper block, and wetting agent, multi-pass cold drawing, and molding.

LIU K, SHENG X, HE G, HAN N, LI M, SHEN Z, HUANG H

Preparation of graphene deformation copper-chromium in-situ composite material by using planetary ball mill under protection of inert atmosphere to graphene chromium powder and copper powder for liquid nitrogen low temperature ball milling.

LIU K, SHENG X, HAN N, HE G, LI M, ZHANG Y, FU K

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E