国家/地区 中国（5）
IPC部 C（5）
IPC大类 C01（5）
IPC小类 C01B（5） C22F（5） C21D（4）
C22C（2） C23C（2）
IPC C22F001/08（5）
发明人 WANG X（2）
公开年 2021（5）
申请年 2021（5）
专利权人

Method for preparing high-strength and high-conductivity copper/graphene composite material, involves conducting electrical and thermal conductivity, tensile properties and other tests on rolled clad sheet and heat-treated clad sheet, and comparing and observing microstructures.

YI Y, WANG G, ZHANG S, YU H, ZHANG X, JIANG Q

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing nitrogen-doped graphene comprises taking ionic liquid as precursor, spin-coating ionic liquid on the annealed copper foil in argon/hydrogen atmosphere and preparing nitrogen-doped graphene by high-temperature thermal decomposition.

GUAN S, WANG X, LI S, PENG Y

Boron-doped graphene reinforced copper-based composite material, is doped with boron on graphene sheet to form boron-doped graphene which is distributed in copper substrate, and copper-boron-carbon bond.

YANG M, LI T, LIU W, WANG Y, HOU H

Vertical graphene composite heat conducting copper foil comprises copper foil substrate layer adhered with two plane graphene layers at surface and bottom, where surfaces of plane graphene layers have vertical graphene layers.

ZHANG L, YE Q, WANG X, SHEN L