国家/地区 中国（4）
IPC部 B（4）
IPC大类 B32（4） C08（4）
IPC小类 B32B（4）
IPC B32B027/04（4）
发明人 CHAI S（2） SU X（2）
公开年 2014（4）
申请年 2013（4）
专利权人 GUANGDONG SH.（2）

Aluminum composite material used for laminate substrate, comprises preset amount of graphene oxide-coated alumina particles, allyl phenolic compound-modified bismaleimide-diisocyanate compound and curing agent.

ZENG X, GUO H, SUN R, PENG C, YAO Y

Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.

CHAI S, SU X

Graphene polymer sheet consists of reinforcing material for use in military, aircraft and ship applications, and graphene film-forming resin comprising graphene and resin composition, in mass ratio of preset range.

CENG M, CENG S, YANG J

Prepreg for laminate used for printed circuit board comprises reinforcing material which is impregnated by thermosetting resin composition and dried in which reinforced material is graphene oxide or graphene subjected to coating process.

SU X, CHAI S