国家/地区 中国（22）
IPC部 C（22）
IPC大类 C08（22） C09（22） B29（5）
C01（5） H01（4） H05（4）
B82（3） B33（2）
IPC小类 C08L（22）
IPC C08L101/00（22）
发明人 LIU Y（3） LI J（2） LIN C（2）
QU B（2） YAO L（2）
公开年 2021（8） 2017（3） 2019（3） 2012（2） 2022（2）
申请年 2021（5）  2020（4）  2015（3）  2017（3）  2019（3）  2011（2） 
专利权人

Preparing high thermal conductivity resin useful for PCB plug holes, comprises e.g. introducing thermally conductive filler and low dielectric loss resin into preheating machine, carrying out preheating treatment to it by preheating machine; weighing graphene, and passing into mixing drum.

NIE X

Heat-conducting wave-absorbing sheet comprises base material composed of porous elastic foam and heat-conducting composite material mixture composed of liquid rubber, heat-conducting wave-absorbing filler and cross-linking agent aging agent.

WANG T, FENG Z, CHEN G, LI Z, TANG Z

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Preparing radiating eye-protecting table lamp comprises e.g. preparing base, support, lampshade shell and lampshade cover plate, assembling base, support, lampshade shell, lampshade cover plate and LED lamp assembly, and forming base, support and lampshade shell by injection molding.

WANG K, TANG J, YAO L

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Filament material for marking three-dimensional (3D) printed object, has polymer resin (compatible with extrusion based printing process), and marking additive that allows portions of filament material to change color when exposed to light.

HU N X, HU N

Heat conducting interface material useful in electronic product and/or automobile field comprises heat-conducting film layer compounded on first resin layer and second resin layer compounded on heat-conducting film layer.

WANG Y

Preparation of high-orientation graphene oxide-based high heat-conducting composite resin involves preparing graphene mixed solution, dispersing with heat conducting filler and graphene gap, concentrating, freeze-drying, and annealing.

ZHAO Y

High-efficiency antibacterial heat-conducting wear-resistant layer used for floor, is prepared by blending e.g. resin substrate, graphene filler, ceramic filler, curing agent, solvent, antioxidant and additive, hot pressing, and molding.

XIAO P, WANG Q, LIU H

Preparing graphene thermal interface material involves preparing graphene oxide composite thermal conductive filler, adding graphene oxide composite thermal conductive filler to the reducing agent.

YAO L, LIU M, LIU Y, ZHENG J, ZHANG K