国家/地区 中国（71）
IPC部 C（71）
IPC大类 C09（71）
IPC小类 C09K（71） H05K（67） C08K（31）
C08L（30） C01B（19） C08J（11）
H01B（9） H01L（7） B82Y（6）
C04B（6） C09D（6） H05B（5）
F28F（4） B29C（3） B32B（3）
IPC C09K005/14（71）
发明人 YANG S（7） CAO Y（5） CHEN X（5）
FANG X（5） CHEN Y（4） MA C（4）
ZHANG L（4） ZHOU B（4） CHEN K（3）
LI F（3） LI J（3） LIU W（3）
XIE Y（3） CHENG H（2） GUO H（2）
公开年 2021（17） 2022（16） 2023（12） 2018（8） 2019（5） 2015（3） 2017（3） 2014（2） 2020（2）
申请年 2022（23）  2020（13）  2018（8）  2021（8）  2019（6）  2015（4）  2016（3）  2011（2）  2013（2） 
专利权人 HANGZHOU FUX.（4） SHENZHEN HFC.（4） UNIV SOUTH C.（4） SHENZHEN HFC.（3）
CETC NO 33 I.（2） INST METAL R.（2） NINGBO INST .（2） UNIV SHANGHA.（2）
UNIV ZHONGSH.（2）

Graphene-based enhanced heat conducting sheet, comprises graphene heat conduction sheet substrate, reinforcing body and connecting layer.

SUN H, ZHOU B, TANG Z, LI F

Preparation of titanium carbide MXene/reduced graphene oxide/gold-copper nanoparticle aerogel for electrothermal and photothermal device, involves preparing gold-copper nanoparticle powder, adding to MXene/graphene oxide mixed solution, adding ascorbic acid, stirring, and heating obtained precursor.

YIN S, QIAO H, QIN W

Flexible graphite composite heat-conducting film, comprises a laminated graphite layer and an adhesive layer.

WAN P, HAO L, TANG Z, TAO X, ZHOU B

Preparation of multilayer self-fused graphene heat conducting film involves preparing pre-reduced graphene oxide slurry, pouring substrate, coating to form film, drying, stacking, graphitizing under argon atmosphere, and rolling.

KONG Q, TAO Z, YANG S, LIU Z

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparing graphene-based thermally conductive/conductive composite material, comprises e.g. pressing open-cell metal foam laminate, annealing pressed foam metal, catalyzing graphene on the surface of the metal foam substrate, removing the metal substrate, and post-processing.

CHENG H, LIU H, MA C, REN W

High-resilience and low-thermal-resistance interface material comprises graphene heat-conducting film, where graphene heat-conducting film runs through and provided with some heat-conducting holes, heat-conducting holes is filled with thermally conductive slurry.

FANG X, SUN A, YANG S, CAO Y

Preparation of high-thermal conductivity graphene heat-dissipation film involves adding graphene oxide film to be treated to chamber of continuous microwave processing equipment, vacuuming chamber, pretreating, and performing photoreduction and high-temperature structural reformation process.

ZHAO Z, ZHANG Y

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K