国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08J（7）
IPC C08K003/08（7）
发明人 HU Y（3） ZHAO W（2）
公开年 2018（2） 2022（2） 2023（2）
申请年 2017（2）  2022（2） 
专利权人

Ultra-thin low-resistance conductive polymer film, obtained by blending polymer, conductive substances and auxiliary agent to form blend, extruding and stretching into film and electroplating via copper sulfate solution to further grow copper on film.

ZHAO W, REN J, LI G, HU Y, JIANG Y, MA Y, ZHI L

Preparing composite current collector base film used for preparing composite current collector of lithium battery, involves doping conductive particles containing conductive polymer and/or inorganic particles, and auxiliary agent in polymer matrix as carrier, where formed base film has conductivity.

KUAI Y, FANG Y, XU X, ZHOU G, PAN J, LIANG Y, XU H

Integrated carbon nanotube grafted graphene conductive composite material useful in conductive elastomer in e.g. stretchable electrode, is three-dimensional network structure, and nickel metal nanoparticles used as nodes to connect graphene and carbon nanotubes.

LIU C, ZENG J, ZHAO W, ZHANG S, MA S, WANG Q

Preparing conductive sponge useful in field of pressure sensor comprises e.g. heating and dissolving elastic resin in solvent to obtain elastic resin carrier, mixing conductive filler with resin carrier, adding second solvent in mixed slurry, dipping sponge into conductive slurry, drying.

GAO F, HUANG L, HU Y, ZENG X, ZHOU H, ZHOU B

Manufacture of metalized porous conductive polymer material used as e.g. conductive material, involves immersing porous polymer material containing styrene-based thermoplastic polymer in metal precursor solution, adsorbing and drying.

HU Y, TIAN D, WANG Y, LIN Z, ZHANG L, ZHAO T, DENG F, SUN R

Preparing composite conductive film comprises e.g. mixing graphene and potassium permanganate solution, heating, stirring reaction, filtering, washing and then mixing chitosan solution, polyvinyl alcohol solution and reducing agent.

LONG S, YIN L, CHEN Y

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q