国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5）
IPC小类 C25D（5）
IPC C25D015/00（2）
发明人 LIU X（5）
公开年 2022（5）
申请年 2022（3）  2021（2） 
专利权人

Preparing graphene/copper composite material useful in field of heat conduction, comprises e.g. preparing deposition solution, polishing anode and cathode plate, removing oil stain, carrying out alternate electrodeposition and performing asynchronous rolling and recrystallization annealing.

LIU X, WANG D, AN X, WEI K, XIA C, WEI W

Method for preparing silicon carbide nanowire network p-n junction film on copper foil-graphene substrate, involves placing electrode in electrophoresis liquid containing nano-wire with different doping types, and combining electrophoretic deposition.

WEI G, DI P, MA L, DU L, ZANG Y, ZHANG Z, LIU X, NIU X

Peeling layer useful for preparing ultra-thin copper foil, comprises barrier layer on carrier copper foil, conductive layer on barrier layer, and crystalline layer on the conductive layer, and the ultra-thin copper foil is formed on crystalline layer.

CHE S, XIANG C, GAO Y, SU X, HE W, WANG S, CHEN Y, ZHOU G, HONG Y, LIU X, WANG C

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X

Preparing composite plating layer useful in preparing electric contact material, comprises e.g. taking composite plating solution as plating solution, carrying out electric brush plating on surface of substrate to obtain composite plating layer and composite plating solution is silver nitrate.

MAO R, JIA L, YU J, HU J, HE C, YE Z, LIU X, CHEN W, TIAN X, PEI F