国家/地区 中国（10）
IPC部 F（10）
IPC大类 F28（10）
IPC小类 F28D（10）
IPC H05K007/20（7） F24H007/02（3） F24H009/18（3）
F24H009/20（3） F28D020/02（3） H05B003/14（3）
F28D009/00（2） F28D015/04（2） G06F001/20（2）
H01L023/427（2）
发明人 CHEN M（3） YANG C（3） ZHU D（3）
CHEN Y（2） HONG Y（2） HORNG A（2）
公开年 2021（9）
申请年 2020（10）
专利权人 SHANGHAI ZON.（3） SUNONWEALTH .（2）

Carbon-based flexible high thermal conductivity heat transfer mechanism useful for transferring heat from heat source to heat sink e.g. radiator, comprises heat conducting belt body used as fast transmission path of heat and heat conducting belt joint for ensuring minimum contact thermal resistance.

HE Y

Uniform temperature plate for use in radiating device for radiating electronic component, has protective layer connected to outer surface of heat conducting sheet, where thickness of protective layer is in specific range.

CHEN Y, YEH C, HONG Y, HORNG A

Phase change energy storage bidirectional heating quartz glass tube water heater and heating device has inner shell which is provided with canning hole for phase change material, and tank that is equipped with phase change heat storage and energy storage medium.

ZHU D, YANG C, CHEN M

Thin-type uniform temperature plate coated with graphene, has heat absorbing plate and radiating plate that are covered with each other, where side of heat absorbing plate and radiating plate are arranged far away from groove that is sprayed with graphene layer.

CHEN X

Phase change energy storage graphene carbon nano-tube electric heating furnace, has heat exchange coil pipe provided with water inlet passage for exchanging cold and hot water, and heat energy storage medium filled in inner container shell.

CHEN M, YANG C, ZHU D

Phase change energy storage graphene carbon nano-tube multiple circulation heating device, has heat exchange coil pipe provided with water inlet passage for exchanging cold and hot water, and tank filled with phase change heat storage energy storage medium.

CHEN M, ZHU D, YANG C

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Gas and liquid heat exchange anti-corrosion printed circuit board heat exchanger, has heat exchanger core body provided with first heat exchange plate substrate, and fluid flow passage connected between first and second heat exchange plate.

LIN X, YIN L, WANG Q, SU W

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y