国家/地区 台湾（12）
IPC部 F（12） H（9） C（3）
G（3） B（2）
IPC大类 F28（12）
IPC小类 F28F（9） H05K（8） F28D（5）
G06F（3） H01L（3） B32B（2）
C01B（2）
IPC H05K007/20（8） F28D015/04（3） F28F013/18（3）
F28F021/02（3） G06F001/20（3） B32B009/00（2）
B32B009/04（2） B32B015/04（2）
发明人 CHEN Y（2） HONG Y（2） HORNG A（2）
公开年 2021（12）
申请年 2020（7）  2019（3）  2021（2） 
专利权人 SUNONWEALTH .（2）

Uniform temperature plate for use in radiating device for radiating electronic component, has protective layer connected to outer surface of heat conducting sheet, where thickness of protective layer is in specific range.

CHEN Y, YEH C, HONG Y, HORNG A

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Assembly for a battery, includes thermal management multilayer sheet equipped on surface of an electrochemical cell, and thermal management multilayer sheet comprising thermally-insulating layer.

CHURCHILL C, DAIGLE R C, KILHENNY B, DAGLE R

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M

Graphene spraying process, involves forming connection layer on surface of heat dissipation fin, welding heat pipe to connecting layer of radiating fin, and removing connection layer.

LIANG P, HUANG T

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

Remote heat exchanging module for e.g. portable computer, has heat generated by heat source transferred to second end of second heat conduction element sequentially through the first heat conduction element, and dissipated out of remote heat exchanging module through the heat dissipation element.

LIAO W, LIN K, LIN G

Heat dissipating device, disposed on circuit board, comprises first glue layer, disposed on circuit board, first graphene composite heat dissipating layer, second glue layer, second graphene composite heat dissipating layer, and resin layer.

CHANG C F

Heat transfer enhancement device, has substrate provided with heating surface, and graphene layer uniformly coated on heating surface and provided with graphene surface and working fluid, where working fluid is exchanged with surface of graphene.

YANG C, SU C, HUANG C, JHANG B