国家/地区 台湾（4）
IPC部 C（4）
IPC大类 C01（3） H05（3） H01（2）
IPC小类 C01B（3） H05K（3） H01L（2）
IPC H05K007/20（3） C01B032/182（2） C01B032/20（2）
H01L023/373（2）
发明人 HUANG C（4）
公开年 2022（4）
申请年 2021（4） 
专利权人 CTRON ADVANC.（3）

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Nanogel for preventing or treating disease or condition susceptible to amelioration by anticoagulant or antioxidant for e.g. thrombophilia, vascular thrombosis, comprises graphene-like nanosheet and polysaccharide.

LIN H, HUANG C, MAO J, WANG C, HUANG Z

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H