国家/地区 美国（7）
IPC部 C（7） H（6） B（2）
IPC大类 C23（7）
IPC小类 C23C（7） C25D（7） C01B（6）
H01B（2） H01L（2） H01M（2）
IPC C25D005/54（7）
发明人 LIPOMI D J（2） ZARETSKI A（2）
公开年 2017（2）
申请年 2015（2）  2016（2） 
专利权人 UNIV CALIFOR.（2）

Multilayer electrically conductive wire for use in aeronautics field to lighten airplane, has central support core, set of pairs of layers around central support core comprising intercalary layer made of non-carbon based material and graphene layer, and first layer arranged on outer surface.

LEKARSKI K

High-conductivity electrical interconnect structure for electrically interconnecting electrical components, has metallic overlay portion that connects peripheral edges of graphene elements with each other.

TANIELIAN M H

Producing highly conducting film of highly oriented conductor-bonded graphene sheets, useful in thermal management device, comprises e.g. preparing graphene dispersion having discrete graphene sheets dispersed in fluid medium.

ZHAMU A, JANG B Z

Manufacturing method of graphene layer on substrate, involves exfoliating metalized graphene layer from first substrate and laminating metalized graphene layer to second substrate.

ZARETSKI A, LIPOMI D J

Method of manufacturing graphene layer on substrate, involves laminating metalized graphene layer to second substrate.

LIPOMI D J, ZARETSKI A, LIPOMI D

Flexible substrate processing apparatus used for reducing graphene oxide to form graphene comprises substrate carrying-out portion; reduction treatment portion; washing portion; drying portion; and substrate carrying-in portion.

TAKAHASHI M, SAITO Y, MOMO J, MORIWAKA T, KUSUMOTO N, MORIWAKA K, YONEDA Y

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J