国家/地区 美国（13）
IPC部 B（13）
IPC大类 B32（13）
IPC小类 B32B（13）
IPC B32B015/08（13）
发明人 HEO C（2） HEO C H（2） HEO J H（2）
KANG T（2） KANG T W（2） KANGTAEWOON（2）
KIM J（2） KIM Y S（2） LEE J（2）
LIU H（2） PARK Y（2） PARK Y S（2）
SOON P Y（2）
公开年 2021（6） 2014（2）
申请年 2020（4）  2012（2） 
专利权人 POSCO（3） HANKOOK ALUM.（2） KOREA ALUMIN.（2） KOREA ALUMIN.（2）

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.

YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y

Secondary battery pouch film comprises sealant layer, adhesive layer formed on sealant layer, primer layer formed on adhesive layer, core layer formed on primer layer and surface layer, where at least one above-mentioned layer has graphene.

HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T, HEO J H, SOON P Y, KANGTAEWOON

Packaging film useful for packaging retort food and medicinal material comprises first adhesive layer formed on sealant layer, core layer formed on first adhesive layer, second adhesive layer formed on core layer, and surface layer.

HEO J H, SOON P Y, KANGTAEWOON, HEO C H, PARK Y S, KANG T W, HEO C, PARK Y, KANG T

Non-isotropic article comprises at least one metallic material layer comprising at least one metal chosen from the group consisting of aluminum, cobalt, copper, iron, nickel, tin, titanium and zinc.

PALUMBO G, KATUGAHA H, MCCREA J, TOMANTSCHGER K, PANAGIOTOPOULOS K

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Preparing nitrogen-doped graphene, used to produce composite heat dispatching plate, comprises mixing solid-state nitrogen containing precursor with a graphene to form a mixture, and sintering the mixture under reducing atmosphere.

LIU W J, SHEN J, XIE Z Z, LIU W, XIE Z

Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X