国家/地区 美国（6）
IPC部 B（6）
IPC大类 B32（6）
IPC小类 B32B（6）
IPC B32B015/08（6）
发明人
公开年 2021（2）
申请年 2012（2） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.

YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y

Graphene dissipation structure for e.g. heat dissipation devices, has substrate containing surfaces, and graphene dissipation layer containing surface-modified graphene nano sheets, carrier resin and filler, in specified weight ratio.

WU M Y, HSIEH C, CHEN J, HSIEH S, LI K, XIE S, WU Y, XIE C, LI G, HSIEH C Y, CHEN J R, HSIEH S L, LI K T

Coated particle, useful in a heat transfer sheet that is useful in electric components and an electronic device, comprises board-shaped/wire shaped base particle made of metal, and graphene layer covering surface of the base particle.

JANG S W, KWON O K, CHOI J O

Transfer sheet used for e.g. capacitance-type touch input device, has base sheet, thin metal film layer, and transparent conductive film layer containing graphene as main component, formed sequentially.

MORI F, TERAZONO H, TERAZONO S