国家/地区 世界知识产权组织（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08K（6） B32B（3） C08J（3）
C08L（3） C09D（3） C09K（2）
F01N（2） F02C（2） H05K（2）
IPC C08K003/04（6） C09D007/61（3） C08J005/04（2）
C08K007/06（2） C09K005/14（2） H05K007/20（2）
发明人 LI Z（2） PICCALUGA P（2） STEFFAN C（2）
公开年 2021（7）
申请年 2020（8）
专利权人 FLEBUS O（2） PICCALUGA P（2） STEFFAN C（2）

Composite material used for multilayer armor system, comprises thermosetting polymer reinforced with natural fiber.

NEVES MONTEIRO S, CAMPOSO PEREIRA A

Demagnetizing and electromagnetic magnetic depolarizing information effect of electric and magnetic fields of air by presence of deployed metal grid inserted in air circulation by switching depolarized fields of structure in exchange on air.

JOSE B, PICCALUGA P, STEFFAN C

Method for correcting Brownian effect of particles in quantum entanglement, involves moving circulation of ordered particles by quantum electrodynamics on axis oriented by electric/magnetic fields of pigments.

BUENDIA J, PICCALUGA P, STEFFAN C, PERRICHON C, MARTY F, FLEBUS O, CHARBONNEAUX M

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Toothed belt used in oil environment, comprises elastic base component comprising at least one textile layer, and elastomer coating comprising polymer base(s) e.g. acrylate rubber, filler(s), reactive diluent(s) e.g. acrylate, and lubricant.

KANZOW H, TEVES R, FINZELBERG J, WELL M, MAHNKEN C, SCHOENFELDER F, SCHONFELDER F

Processing graphene phenolic polymer composite air duct sheet involves using phenolic resin, curing agent, foaming agent and graphene water agent.

ZHANG C, WANG Y

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y