国家/地区 韩国（7） 美国（3） 世界知识产权组织（3） 中国（2）
IPC部 C（7） B（3） H（3）
IPC大类 C01（7） B82（3） H01（3）
C25（2）
IPC小类 C01B（7） B82Y（3） C25D（2）
H01M（2）
IPC C01B032/182（7） B82Y030/00（2） C01B031/04（2）
C25D003/38（2） C25D005/50（2） C25D007/06（2）
发明人 LEE S H（7）
公开年 2018（5） 2017（2）
申请年 2017（7）
专利权人 ILJIN MATERI.（2） KOREA ADVANC.（2）

Porous hetero nanostructure used in lithium ion battery, comprises gelatin and at least two graphene oxide units comprising graphene oxide sheet, one or more nano holes in sheet, and metal particles located in at least one of nano holes.

OH I, LEE S H, KOTAL M, OH J H

Growing thickness of reduced graphene oxide comprises dispersing reduced graphene oxide powder, adding metal nano powder to obtain dispersed mixture, drying dispersed mixture, and heating.

JEE Y H, LEE S H, KIM K W

Manufacture of graphene oxide/silicon composite used for secondary battery, involves coating graphene oxide dispersion solution on nickel foam, coating silicon nanopowder dispersion solution on graphene-coated nickel foam, and laminating.

LEE C S, LEE S H

Manufacture of graphene thin film involves depositing metal catalyst on mold including substrate having graphene layer, forming graphene thin film on metal catalyst layer by chemical vapor deposition, and removing catalyst layer from mold.

LEE S H, BAE S, RHO H K, KIM T W, LEE S K, LEE D S

Polymer-based, wideband electromagnetic wave shielding film, e.g., for wearable electronics, has filler which includes nanostructure including multilayer graphene, nanotubes between layers, and metal oxide connected to nanotubes.

OH I, LEE S H

Electrolytic copper foil used for producing graphene, has preset ratio of surface roughness of copper foil and surface roughness of copper foil after heat treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K