国家/地区 中国（7）
IPC部 B（8）
IPC大类 B82（8）
IPC小类 B82Y（8） C09K（8） C01B（4）
C08K（2） C08L（2） C09D（2）
C25D（2）
IPC C09K005/14（8）
发明人 PAN Z（2） TAN H（2）
公开年 2021（4） 2020（2） 2022（2）
申请年 2020（8）
专利权人 ANHUI AEROSP.（2）

Preparing silicene-coated graphene involves putting the silicon powder raw material in the feeding system, melting to form molten droplets, and cooling the molten droplets into nano-scale silicon crystals during the falling process.

LIANG Y

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Modified graphene nanomaterial useful in microelectronic device or electronic component, comprises e.g. graphite powder, deionized water, catalytic auxiliary agent, magnesium oxide, modified bauxite, and sodium N-dodecylbenzene sulfonate.

HUANG Z

Preparing a complex thermal interface material based on three-dimensional graphene comprises e.g. preparing oxide-modified graphene complex hydrogel by self-assembly method, and preparing three-dimensional graphene complex aerogel.

TAN H, PAN Z

Preparing hybrid double-coated boron nitride/graphene insulating and thermally conductive silicone grease, by adding boron nitride to solvent, adding alcohol, organic solvent and graphene, distilling and mixing with organosilicone.

ZHANG C, RAN W, LI Z

Composite useful for fabricating pristine, graphene/graphite/polymer composite foams, comprises a polymeric matrix material formed from boron nitride and/or a polymer that defines an open pore foam structure.

ADAMSON D H, WOLTORNIST S, DOBRYNIN A V

Preparing polypyrrole nanowire interface modified three-dimensional graphene/polydimethylsiloxane composite photothermal material comprises e.g. cleaning nickel foam, ultrasonicting, washing with deionized water, and drying with nitrogen.

ZHANG B, QIU Y

Preparing thermal interface material comprises preparing carbon nanotube film, configuring e.g. graphene oxide, covering layer of carbon nanotube film, mixing dispersion solution and forming three-dimensional network structure.

TAN H, PAN Z