国家/地区 印度（5）
IPC部 C（5） H（4） B（2）
IPC大类 C23（5）
IPC小类 C23C（5） H01L（3） C30B（2）
H05K（2）
IPC H01L021/02（2）
发明人
公开年 2022（2） 2023（2）
申请年 2021（5）
专利权人

Depositing gate dielectric on two-dimensional material involves depositing seed layer over atomically smooth surface of two dimensional material, evaporating predefined thickness of seed layer from atomically smooth surface, and performing atomic layer deposition.

SHRIVASTAVA M, KHANEJA M, MEERSHA A

System for preparing core-shell polymer yarn, has inner core containing polymer monofilament(s) or polymer multifilament, and outer shell containing mixture of at least one polymer with specified softening point, biocide and/or additive containing metallic, ceramic, inorganic or organic group.

MAHAJAN C, GUNARI N, GARWARE V R

P-type transparent conductor with highly reduced graphene oxide thin film, has substrate and highly reduced graphene oxide thin film deposited on the substrate, in which the film is directly grown on substrate by pulsed laser deposition.

RAO R M S, JUVAID M M, SARKAR S, VENKATESAN T

Preparing nanocubons by mixing polypropylene carbonate in tetrahydrofuran to obtain mixture, emulsifying with polyvinyl alcohol to obtain emulsion, ultrasonically processing to obtain ultrasonically processed mixture, and evaporating solvent from mixture followed by pelleting to obtain nanocubons.

SRIVASTAVA R, JHA A

Heat transferable biodegradable substrate used for manufacturing moldable interconnect devices (MIDs), comprises first layer comprising poly lactic acid (PLA) matrix dispersed with graphene oxide (GO) particles and second layer.

WINOWLIN J J T, ABHISHEK S, AMEENUDEEN Z, ADAM K M