国家/地区 中国（14）
IPC部 C（11） B（3）
IPC大类 C08（6） C01（2） C09（2）
IPC小类 C08K（6） C08L（6） C08J（3）
C01B（2） C09D（2）
IPC C08K003/04（6） C08K003/22（3） C08K013/02（3）
C08J005/18（2） C08K003/08（2） C08K003/30（2）
C08K003/34（2） C08K003/36（2） C08K003/38（2）
C08L061/14（2） C09D007/61（2） C09D129/04（2）
发明人 HE J（14） YANG B（2）
公开年 2018（5） 2017（4） 2020（2） 2021（2）
申请年 2016（5）  2017（4）  2018（3）  2020（2） 
专利权人 HE J（14）

Low shrinkage thermoplastic polyurethane film is prepared using thermoplastic polyurethane particles, polypropylene, calcium carbonate, graphene material, glass fiber and antioxidant.

HE J, YANG B

Highly transparent thermoplastic polyurethane film useful for protection of electronic products comprises polyester polyol, polyethylene glycol, fluorine-containing polyol, isophorone diisocyanate, chain extender and modified graphite oxide.

HE J, YANG B

Graphene solar cell silver paste comprises modified graphene comprising surface-modified graphene, silver powder, organic binder, organic solvent, and glass powder.

HE J

Preparation of graphene material involves ultrasonically processing composite solution formed by mixing graphene oxide suspension with zeolite suspension to form atomized droplets, treating droplets with plasma and depositing on substrate.

HE J

Preparing graphene powder comprises cracking the graphite raw material with a gas jet.

HE J

LED lamp coating material comprises preset amount of modified graphene, zinc oxide powder, cyclohexanone, titanium dioxide, polyvinyl alcohol, tributyl phosphate, tackifier, 15-30 silicone oil, conductive carbon black and acrylic resin.

HE J

LED lamp coating material comprises modified graphene, vinyl silicone oil, aluminum oxide, titanium dioxide, polyvinyl alcohol, vinyl silicone resin, tackifier, and hydrogen-containing silicone oil.

HE J

Manufacture of LED lamp radiating material, involves molding mixture of base comprising resin, silicon, kaolin, and lime, and additive comprising boron nitride, manganese sulfide, graphene, copper, potassium sulfate, and antioxidant.

HE J

Light-emitting diode lamp tube material comprises bisphenol A type polycarbonate, tackifier, polymethyl methacrylate, stearic acid amide, modified graphene, zinc oxide powder, cyclohexanone, titanium dioxide and tributyl phosphate.

HE J

Heat dissipating material used for light-emitting diode lamp includes silicone modified phenolic resin, magnesium oxide, silicon micropowder, kaolin, boron nitride, lime powder, manganese sulfide, graphene, metal powder and antioxidant.

HE J