国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（3） C08（2）
IPC小类 C08J（2） C08L（2）
IPC C08L063/00（2）
发明人 SUN R（4） LAI Z（2） LIANG X（2）
REN L（2） XU J（2） ZENG X（2）
ZHAO T（2）
公开年 2021（4）
申请年 2020（3） 
专利权人 SHENZHEN ADVANCED ELECTRONIC MATERIAL（4）

Polymer composite thermal interface material comprises crosslinking agent, lipoic acid and/or derivative, thermal conductive filler and aluminum salt.

REN L, WANG Z, YE W, ZENG X, SUN R, XU J

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Thermally conductive double-sided adhesive tape includes a substrate, a thermally conductive adhesive film and a release film, and both sides of the base layer are coated with a thermally conductive adhesive film containing holes.

LAI Z, LIANG X, ZHAO T, SUN R

Preparation of thermal interface materials involves immersing graphite powder in acidic aqueous solution, grafting, mixing with e.g. thermosetting resin, applying on release film, peeling, pressing, cutting, and curing.

ZENG X, SUN R, XU J, DENG F, XIN P, REN L, ZHANG C, YE Z