国家/地区 中国（9）
IPC部 C（8） H（4） D（2）
IPC大类 C08（7） H05（4） D01（2）
IPC小类 C08K（7） C08L（6） H05K（4）
IPC C08K003/04（6） C08K007/00（5） C08L063/00（4）
H05K009/00（4） C08K009/02（2） C08K009/04（2）
发明人 GU J（9）
公开年 2018（3）
申请年 2018（3） 
专利权人 UNIV NORTHWESTERN POLYTECHNICAL（9）

Preparing titanium carbide/graphene microchip/polylactic acid electromagnetic shielding composite material by mixing titanium aluminum carbide powder with stripping liquid of e.g. lithium, peeling, obtaining film, laminating it with graphene flake/polylactic acid composite material.

GU J, MA H, SHI X, MA T

Preparation of carbon nanotube/graphene hybrid material used for high heat conducting polymer-based composite material by mixing graphene oxide, dicyclopentadienyl iron and absolute ethyl alcohol, drying, and microwave reducing.

GU J, GUO Y, HAN Y, YANG X, MA T

Three-dimensional silver-graphene hybrid foam/epoxy-resin electromagnetic shielding composite material comprises thermosetting epoxy resin, 4-Dodecylbenzenesulfonic Acid, graphene oxide foam, silver sheet and curing agent.

GU J, LIANG C, KONG J, QIU H, SONG P, YIN X

Polyimide-based thermally conductive composite material comprises polyimide, graphene, and silver nanoparticle, where graphene is dispersed in a polyimide substrate, and silver nanoparticle is loaded on surface of graphene.

GUO Y, GU J, YANG X, ZHU G, JIANG J, ZHOU Z, ZHANG Y, HE M

Preparation of epoxy resin-based electromagnetic shielding composite material involves mixing aminated ferroferric oxide, graphene oxide and water and ultrasonically treating to obtain aminated ferroferric oxide-graphene oxide dispersion.

GU J, HUANGFU Y, LIANG C, QIU H, HAN Y

Epoxy resin based electromagnetic shielding composite material comprises preset amount of polyvinyl alcohol, graphene oxide, graphene microchips, epoxy resin and curing agent.

LIANG C, GU J, SONG P, WANG L, HUANGFU Y

Modified graphene/polyimide heat conducting composite material comprises polyimide and modified graphene.

GU J, GUO Y, LIANG C, YANG X, LV Z, ZHANG Q

Thermal conducting composite material comprises epoxy resin, graphene microchip, powdered nitrile rubber, methylhexahydrophthalic anhydride and gamma-(2,3-epoxypropoxy) propyltrimethoxysilicane.

GENG W, GU J, XU S, ZHANG Q, TIAN L, YANG X

Composite material comprises polyphenylene sulfide resin, graphene micro sheet heat conducting filler, titanate coupling agent and solvent.

ZHANG Q, DANG J, GU J, FENG Z