国家/地区 韩国（5） 美国（4）
IPC部 H（4） C（3） G（2）
IPC大类 H01（4） C01（2） G03（2）
IPC小类 H01L（3） C01B（2） G03F（2）
IPC C01B031/04（2） G03F007/09（2） G03F007/11（2）
H01L021/027（2）
发明人 CHO Y（6）
公开年 2016（6）
申请年 2015（4）  2014（2） 
专利权人 SAMSUNG ELEC.（3） AICT（2） PURITECH CO .（2）

Hardmask composition used for forming pattern, comprises several graphene nanoparticles having size of preset range, and solvent.

SHIN H, KIM S, SEOL M, PARK S, CHO Y, SHIN H J, KIM S W, SEOL M S, PARK S J, CHO Y C, XUE M, ZHAO L

Hardmask composition for pattern formation comprises a set of graphene nanosheets, each being doped with boron and/or nitrogen, and a solvent.

SEOL M, KIM S, SHIN H, PARK S, CHO Y, SEOL M S, KIM S W, SHIN H J, PARK S J, CHO Y C

Layer structure for electronic device, has material layers which are on sides of diffusion barrier layer and diffusion barrier layer includes nano-crystalline graphene layer.

SONG H, NAM S, CHO Y, PARK S, SHIN H, LEE J, SONG H J, NAM S G, CHO Y C, PARK S J, SHIN H J, LEE J H

Improvement of electrical energy storage capability of graphene material used in fiber complex, involves heat-treating graphene or material containing graphene at preset temperature in presence of acid and reforming surface of graphene.

PARK S, SHIN M K, KIM H, CHO Y, CHO K

Fiber composite used in e.g. electronic device, comprises microfiber bundles formed by bonding graphene flakes and carbon nanotubes, nanofiber coated with coating material, electrolyte filled in nanofiber web and insulating film.

PARK S, SHIN M K, KIM H, YEO C, CHO Y, CHO K

Formation of complex plating film used in electronic material, involves adding graphene-coated metal powder to plating solution, and forming plating film by performing electric plating in solution to which metal powder is added.

SUH S, SONG Y, PARK J, KIM T, SON H, SHIN J, LEE M, LEE J, LEE C, CHO Y, BAEG S, AHN B, YUN S