国家/地区 韩国（6） 美国（4）
IPC部 H（5） C（3） G（2）
IPC大类 H01（4） C01（2）
IPC小类 H01L（3） C01B（2）
IPC
发明人 KIM K（7）
公开年 2021（7）
申请年 2020（4）  2019（3） 
专利权人

Light emitting display device comprises lower substrate, thin film transistor is provided on lower substrate, passivation layer is provided on thin film transistor, overcoating layer is provided on passivation layer.

SHIN H, LEE K, KIM K, KIM T, KIM J, KIM E, SEO H, KIM G, KIM Y, YAN J, SEOHYUNTAE, KIM E J, KIM J Y, KIM J H, KIM K H, LEE G S, SHIN H D, JIN R, JIN G, JIN E, JIN Z, LI G, SHEN H

Graphene semiconductor junction device comprises substrate, gate electrode, gate insulating layer, graphene layer, semiconductor layer, drain electrode, and source electrode on graphene layer to be separated from semiconductor layer.

KIM K Y, KIM S Y, LEE B H, KIM K

Graphene power generation system, comprises rotating shaft coupled to rotor and configured to rotate together at same angular velocity as electric rotor having first graphene wire winding and is configured to be coupled with rotating shaft.

KIM K, KIM Y

Preparing doped graphene by converting polycrystalline metal catalyst thin film into single crystal metal catalyst thin film through abnormal grain growth and synthesizing doped graphene on thin film by chemical vapor deposition.

KIM K, NAM J

Water-degradable film used for transferring or transcribing nanomaterials, e.g. nanofilms, comprises hyaluronic acid and polyphenol compounds interposed between portion of hyaluronic acid main chains through hydrogen bonding.

LEE J, PARK S, KIM K, LEE J H, PARK S H, KIM G S

Nonvolatile memory apparatus for e.g. phase-change random access memory, consists of electrode(s), resistive-change material layer, diffusion prevention layer comprising two-dimensional material, and blocking layer.

LEE M, PARK S, SONG H, SHIN H, KIM K, LEE S, KANG Y

Flexible electrode manufacturing method involves applying thermal energy to a polymer substrate to form a carbonized region, patterning the carbonized region to form a graphene electrode, and providing an adhesive layer.

KWON S G, AHN J, LIM H J, KIM K, CHOI K, LEE J J