国家/地区 韩国（5） 世界知识产权组织（3）
IPC部 C（5）
IPC大类 C09（5） C08（2） H05（2）
IPC小类 C09D（3） C09J（3） C08K（2）
H05K（2）
IPC C09D007/61（3） C09D175/04（3） C08K003/04（2）
C09D007/40（2） C09J011/04（2） C09J201/00（2）
H05K007/20（2）
发明人 KIMTAEHAN（5）
公开年 2023（3） 2022（2）
申请年 2021（5）
专利权人 PURE MANN IN.（3） PUREMANN INC（2）

Composition used in production of heat-dissipating paint, comprises binder resin comprising urethane resin or epoxy resin, thermally conductive particles comprising expanded graphite particles having preset diameter and metal particles, additives comprising anti-settling agent, and solvent.

HUN L S, SONG J, CHOI S, YUMINSOOK, KIMTAEHAN, LEE S H, SONG J H, CHOI S I, YU M S, KIM T H

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y

One-component urethane heat dissipation paint composition e.g. for coating heat dissipation coating film, comprises e.g. polyol, thermally conductive particles including graphite, additives, block diisocyanate and acetate-based solvent.

KIMTAEHAN, HUN L S, YOUK S K, YUMINSOOK, KIM T H, LEE S H, YU M S

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H