国家/地区 美国（6）
IPC部 H（6）
IPC大类 H01（6）
IPC小类 H01L（5）
IPC H01L021/768（3） H01L021/44（2） H01L023/532（2）
发明人 LIN Q（6）
公开年 2014（3） 2013（2）
申请年 2012（2）  2014（2） 
专利权人 INT BUSINESS.（3） SAMSUNG ELEC.（2）

Microdevice for monitoring target analyte, such as insulin, comprises FET comprising substrate, gate electrode, and microfluidic channel including graphene, where channel is formed between drain and source electrodes.

LIN Q, ZHU Y, SHANG J, ZHANG Z, WANG X, YANG J, WANG C, ROTTI P G, ENGELHARDT J F, HAO Z

Sensing device has second electrode layer that is provided with opening, and graphene layer that is provided to contact with second electrode layer and amorphous silicon layer.

CHEN Z, LIN Q, CHEN T, LIN C, CHEN T H, LIN C MOPTRONICS CORP

Method for forming interconnect structure for integrated microelectronic circuit, involves forming graphene cap directly on uppermost surface of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D

Capacitor cathode foil structure manufacturing method, involves entering carbon precursor into reaction chamber, depositing graphene layer on surface of base foil, and forming graphene layer by graphene thin film.

CHEN M, LIN Q, WANG Y, LIN C, LIN C F, CHEN M T, WANG Y Y

Method for forming interconnect structure for integrated microelectronic circuit, involves transferring graphene from copper foil, and patterning graphene, so that edges are coincided with vertical sidewall surfaces of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D

Interconnect structure for integrated microelectronic circuit, has graphene cap which is provided with edges that are vertically coincident with edges of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D, DIMITRAKOPOULOS C, HANNON J, NEUMAYER D, OTT J, DIMITRAKO P C D, GREER A