国家/地区 中国（7）
IPC部 C（6） B（3） H（3）
IPC大类 C09（4） H05（3） B22（2）
C08（2） C22（2）
IPC小类 C09D（4） H05B（3） B22F（2）
C08G（2） C22C（2）
IPC C09D005/08（2） C09D011/03（2） C09D011/102（2）
C09D011/106（2） C09D011/52（2） H05B003/14（2）
发明人 OU B（7）
公开年 2021（7）
申请年 2021（4）  2020（3） 
专利权人 GUANGDONG GA.（3） QINGYUAN JIA.（3） GUANGXI GANI.（2） JIANGSU PROV.（2）
UNIV HUNAN S.（2）

Preparing heating ceramic tile with stable electrical resistance, comprises pressing and molding tile blank on grooved mold, printing conductive resistance slurry in extrusion groove, curing, and applying insulating layer on surface of ceramic substrate printed with conductive resistance slurry.

LI Z, LIANG G, DENG B, ZHU L, OU B, SU W

Preparation of graphene composite wear-reducing metal material using selective laser melting (SLM) technology, for use in additive manufacturing application, involves selecting alloy powder, drying, grinding, sieving, mixing with graphene powder, spreading, melting, stacking and forming.

LIU W, WANG R, YU H, LU Y, OU B

Self-limiting temperature conductive ink comprises carbon-based conductive filling material, self-limiting temperature material, resin bonding material, additive and solvent.

LI Z, DENG B, YANG J, SU W, ZHU L, OU B

Conductive ink with temperature-limiting characteristic comprises carbon-based conductive filling material, conductive auxiliary materials, temperature limiting material, resin bonding material, additive and solvent.

ZHU L, SU W, DENG B, LI Z, OU B

Preparation of graphene-enhanced nickel-based nanocomposite powder metallurgy material involves cutting graphite into sheet, nano grinding to obtain nano graphene, adding dispersant, putting into centrifuge, and mixing and blending.

OU B, XU C, WANG Q, XIONG L

Preparation of epoxy resin/graphene oxide super-hydrophobic anticorrosive coating by preparing graphene oxide-iron(II, III) oxide nanoparticles, dispersing in mixed solution, mixing epoxy resin, spraying on metal surface and drying.

OU B, WANG Y, XING Y, LU Y, GUO Y

Preparing a repairable graphene oxide material based on hydrogen bonding involves dissolving1,2-bis(2-aminoethoxy)ethane in N,N-dimethylformamide solution, transferring the dissolved solution to single-neck flask.

OU B, LIU G, PENG C, ZHAO X, JIAN S