国家/地区 中国（5） 美国（5） 欧洲专利局（EPO）（3）
IPC部 H（5）
IPC大类 H05（5） H01（4）
IPC小类 H05K（5） H01L（4）
IPC H05K003/00（5） H05K001/02（4） H05K001/18（4）
H05K003/46（4） H01L021/48（3） H01L023/498（3）
H05K001/03（3） H01L023/492（2） H01L023/538（2）
H05K001/09（2） H05K001/11（2）
发明人 TAY S K（5）
公开年 2021（5）
申请年 2020（4） 
专利权人 AT S AUSTRI.（2） AT S AUSTRI.（2） AT S CHINA .（2）

Method for manufacturing component carrier e.g. printed circuit board, involves creating blind hole in stack towards embedded component, and extending blind hole by etching to expose surface portion of embedded component.

TUOMINEN M, TAY S K, ZHENG X

Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack , Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack.

TUOMINEN M, TAY S K, LIU K, BAFTIRI A, GUO H, ZHENG X, LIU Q, GUO Z

Component carrier e.g. laminate-type component carrier, comprises stack comprising electroconductive layer structure(s) and/or electrically insulating layer structure(s), in which portion of structure comprises material.

TAY S K, TUOMINEN M, ZHENG X

Carrier for e.g. electronic components comprises stacked electrically insulating layer structures, and through hole with narrower inner portion compared to exterior portions and filled with electrically conductive filler.

TUOMINEN M, TAY S K, SUN S, ZHANG R, ZHENG X, SUN L, ZHANG Z

Semi-flexible component carrier e.g. semi-flexible printed circuit board (PCB) has electrically insulating layer structure which forms portion of semi-flexible section in which material with elongation of greater than specific value.

XIN N, TUOMINEN M, TAY S K, XIN L, ZHENG X