国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（2） C22（2） C25（2）
C30（2） H01（2）
IPC小类 C22F（2） C25D（2） C30B（2）
IPC C22F001/02（2） C22F001/08（2） C30B029/02（2）
发明人 WANG E（6）
公开年 2021（6）
申请年 2021（6）
专利权人 SONGSHAN LAK.（4） ZHONGKE JING.（2）

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

High barrier antibacterial polycaprolactone emulsion for forming barrier layer, comprises epsilon-caprolactone, L-lactide, oxidized soybean oil, antioxidant, antibacterial agent, initiator, solvent, emulsifier and water.

LI C, WANG E, LI T, FENG L

Preparing two-dimensional single crystal material lamination with large size and interlayer corner comprises growing first and second two-dimensional single crystal material and introducing inert gas and reducing gas, heating and bonding.

LIU K, LIU C, WANG Q, GONG D, WANG E, YU D

Polyimide composite film used preparing conductive elements, comprises polyimide matrix, and three-dimensional conductive network dispersed in polyimide matrix, where components constituting three-dimensional conductive network comprises three-dimensional graphene comprising carbon nanoparticles.

YU J, LI Z, WANG E

Preparing graphene comprises depositing graphene on substrate by chemical vapor deposition, and etching amorphous carbon on surface of graphene by water vapor.

LIU K, YUE X, ZHANG Z, HE M, HUANG Z, WANG E

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E