国家/地区 中国（5）
IPC部 H（4）
IPC大类 H01（4）
IPC小类 H01L（4）
IPC H01L021/336（3）
发明人 WANG S（5）
公开年 2015（5）
申请年 2014（5）
专利权人 INST MICROELECTRONICS CHINESE ACAD SCI（5）

Atomic-level mechanical peeling cleaning of graphene surface used for field effect transistor or electric conduction film by taking target substrate, adhering graphene, soaking in organic solvent, and dissolving graphene surface.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Graphene metal contact removing method, involves coating spin in optical resist layer, forming metal electrode with image in inorganic layer surface, and providing graphene-metal contact area with inorganic layer.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Graphene field effect transistor preparing method, involves providing semiconductor substrate surface with graphene surface, providing spin with organic or inorganic metal protection layer, and providing metal electrode with optical image.

JIN Z, PENG S, WANG X, ZHANG D, WANG S, SHI J

Graphene FET device manufacturing method, involves depositing passivation protection layer using selective etching of passivation protecting layer above grid medium layer, and depositing metal forming source on drain metal electrode.

JIN Z, MA P, WANG X, ZHANG D, WANG S, SHI J

Method for aligning graphene for top gate FET device, involves coating metal on source electrode and drain electrode, and connecting graphene top gate FET device body with electric conduction channel and source and drain electrodes.

JIN Z, MA P, WANG X, ZHANG D, WANG S, SHI J