国家/地区 中国（33）
IPC部 C（12） H（10） B（9）
E（5） A（3） F（3）
G（3）
IPC大类 B32（6） E04（5） H01（5）
H05（4） C04（3） C08（3）
F24（3） G01（3） A24（2）
C01（2） C25（2）
IPC小类 B32B（6） C04B（3） C08K（3）
C08L（3） E04B（3） E04F（3）
F24D（3） G01N（3） H01M（3）
A24B（2） C01B（2） C08J（2）
C25B（2） H01B（2） H05B（2）
IPC B32B007/12（4） B32B009/00（4） B32B009/04（4）
C08K003/04（3） F24D013/02（3） A24B003/10（2）
B32B003/04（2） B32B003/24（2） B32B017/02（2）
B32B025/04（2） B32B027/28（2） B32B027/36（2）
B32B029/00（2） B32B033/00（2） B32B037/06（2）
发明人 WU H（33）
公开年 2023（33）
申请年 2022（33）
专利权人 SHENZHEN XID.（8） HUNAN RUIDA .（3） CHINA WEST C.（2） CHINA WEST C.（2）
JINJIANG GUA.（2） QUJING CO YU.（2） UNIV SICHUAN（2）

Preparing metal phthalocyanine-graphite phase carbon nitride/graphene ternary composite material useful electro-catalytic reduction of carbon dioxide, comprises e.g. adding metal phthalocyanine powder and graphitic carbon nitride powder to sulfuric acid solution, and adding graphene oxide powder.

WU H, REN Z, WANG Z, CHEN Z

Manufacturing method of heat-dissipating printed circuit board (PCB), involves preparing copper clad laminate comprising line copper layer, and preparing graphene electroplating solution to electroplate graphene layer on copper-clad board.

WU H, ZHUANG Q

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Organic-inorganic solid waste composite sound insulation material used in building applications, comprises organic solid waste particles, inorganic solid waste powder, light aggregate, water reducer, retarder, water, and nano aerogel containing nano silicon dioxide aerogel.

LI X, SHI B, WANG J, WU H, KANG S, YANG W, GAO Y, MA P, CHENG B

Method for resetting and wrapping graphene heat dissipation substrate for electronic component, involves bending insulating film beyond edge of first surface of graphene substrate towards side of graphene substrate, and pasting bent insulating film on tape on side of graphene substrate.

WU H, GU D

Mica tape with reinforced wrapping edge used in electric industry, has wrapping mica paper layer that is attached to side of polyimide film layer of mica baseband wrapped by reinforcing fiber fabric layer side.

ZHAO J, CHU G, WU H

Preparing manganese dioxide-reduced graphene oxide modified stainless steel mesh cathode membrane, used as microbial fuel cell-membrane bioreactor component comprises e.g. carrying out constant current anode treatment on manganese acetate solution, and performing constant potential anodic treatment.

WANG J, ZHONG C, LIU H, WANG X, ZHANG W, WANG Y, ZHANG H, ZHANG D, WU H, CHEN M, HU Z, ZHU H

Composite mica tape with anti-cracking structure, has aluminum silicate fiber net surface that is provided with second rhombic mesh whose mesh size is greater than mesh size of first mesh, and both meshes are vertical to each other.

ZHAO J, CHU G, WU H

Graphene for heating cervical vertebra pillow, has supporting box whose surface is movably connected with supporting frame for supporting pillow core, where pillow core is provided with air bag.

REN H, WU H, WANG L

Mica tape comprises mica paper layer and reinforcing fiber fabric layer, where mica paper layer is formed on one side surface of reinforced fiber fabric layer between mica paper layer and reinforcing fiber fabric layer, and lattice hole is uniformly opened on modified polyimide film.

CHU G, ZHAO J, WU H