国家/地区 美国（3） 中国（2） 德国（2） 世界知识产权组织（2）
IPC部 B（5） C（5） H（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B009/00（5）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LIPP E（2）
MENTOVICH E（2） NAVEH D（2） ROTEM Y（2）
公开年 2022（5）
申请年 2022（3） 
专利权人 MELLANOX TEC.（2） PCB TECHNOLO.（2） UNIV BARILAN（2）

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Graphene electromagnetic shielding film with high heat conductivity and high conductivity, comprises graphite oxide containing water is processed into strip by screw extruder, and cutting into particles.

WANG Z

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Producing graphene by forming buffer layer made of silicon oxycarbide and single layer of graphene formed on buffer layer on surface of silicon carbide substrate by heating silicon carbide substrate in atmosphere of acetylene gas and oxygen gas, and peeling single layer of graphene.

TANIYASU Y, SASAKI K, TANAKA S, KAJIWARA T