国家/地区 世界知识产权组织（26）
IPC部 B（26）
IPC大类 B32（26）
IPC小类 B32B（26） C01B（19） C23C（13）
H01L（9） B82Y（8） B05D（6）
H05K（6） C04B（5） H01B（4）
B01J（2） B22D（2） C09D（2）
C09K（2） C30B（2） H01G（2）
IPC B32B015/04（26）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LI Y（2）
LIPP E（2） MAEKAWA T（2） MENTOVICH E（2）
NAVEH D（2） ROTEM Y（2） TAKASHI M（2）
公开年 2014（5） 2021（4） 2022（4） 2011（3） 2013（2） 2020（2）
申请年 2014（5）  2013（3）  2020（3）  2021（3）  2010（2）  2019（2）  2022（2） 
专利权人 MITSUBISHI M.（3） BASF SE（2） MELLANOX TEC.（2） PCB TECHNOLO.（2）
UNIV BARILAN（2）

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K

Thermal insulation material used in building and construction, refrigeration appliance, electronic devices, aerospace and batteries comprises aerogel layer consisting of monolithic organic aerogel and cover layer.

WEINRICH D, FRICKE M, VOGELSANG V, LIED F, ENGEL S

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Foil used as surface section, has coating that is nano-coating in which graphene and silicon are present as nanoparticles, such that interaction of molecules or atoms of coating is made with kinetic energy of radiation.

SCHUBART H T

Graphene bonded body having structure comprises graphene-containing carbonaceous member containing graphene aggregate and member to be joined, junction interface, active metal compound layer formed on member, and tin-concentrated layer.

TOYO O, OHASHI T

Composite heat transfer component used for e.g. power module, comprises plate composed of carbonaceous material comprising composite containing graphene aggregates and graphite particles, and cast metal component that covers plate surface.

MAEKAWA T, YAMASHIMA S, TAKASHI M, SUSUMU Y

Production of graphene on metallic substrate for layered composite, involves depositing layer of carbon barrier material on metallic substrate, depositing layer of chemical vapor deposition catalyst and forming graphene on catalyst layer.

SINGH R, PATWARY S, BANERJEE P C