国家/地区 中国（5） 世界知识产权组织（4） 美国（3） 欧洲专利局（EPO）（2） 日本（2）
IPC部 C（7）
IPC大类 C01（7）
IPC小类 C01B（7）
IPC C01B032/194（7）
发明人 ZHANG X（2）
公开年 2021（6）
申请年 2021（7）
专利权人 MITSUBISHI M.（2）

Producing graphene macro-assembly (GMA)-fullerene composite involves providing graphene oxide, adding hydroxylated fullerene compound to the graphene oxide and performing gelation process using graphene oxide and hydroxylated fullerene.

HERNANDEZ M R C, BIENER M M, CAMPBELL P G

Preparation method of graphene radiating film for electronic device, involves placing graphene after plating copper in mold, and completing production of graphene heat dissipation film by cold pressing and heat treatment.

CAI X, YANG X

Preparation of graphene film for, e.g. aerospace applications, involves preparing graphene oxide, adding ethanol and nickel-based compound, ultrasonically dispersing, applying dispersion on heating plate, putting heating plates in vacuum environment, pressurizing heating plates and natural cooling.

MA P, FAN Y, XIAO Q, LIAO N, ZHANG X

Composite heat-transfer material used as thermally-conductive material in electronic device, comprises carbonaceous component comprising carbonaceous material and metal component comprising metal comprising aluminum alloy or magnesium alloy bonded to surface of carbonaceous component.

TAKASHI M, TAKUYA K, MAEKAWA T, KUBO T

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Copper/graphene junction for e.g. engine compartment, comprises structure in which copper component and graphene-containing carbonaceous component are joined, active metal carbide layer, and magnesium solid solution layer in which magnesium is solid-solved in matrix phase of copper.

NOBUYUKI T, TERASAKI N

Use of silicon carbide whisker modified with fluorosilane coupling agent oligomer, for improving thermal conductivity of silicon carbide ceramic plate used for substrates of high-brightness LED light source.

ZHANG X, LING J, PAN T, BAI W