国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（3） C01（2）
IPC小类 C08G（7） C08K（4） C08L（4）
C01B（2） C09D（2）
IPC C08G059/50（7）
发明人
公开年 2018（6）
申请年 2018（7）
专利权人

Graphene microsphere/epoxy resin composite material has hexagonal honeycomb structure, and includes graphene microspheres, epoxy resin and curing agent.

ZENG X, LI C, SUN R, ME Y

Composite material contains epoxy resin, butadiene rubber, terminal carboxylated nitrile rubber, stearic acid, sulfur, N-cyclohexyl-2-benzothiazolesulfenamide, nano titanium dioxide, graphene oxide, and hexaphenoxycyclotriphosphazene.

LI X

Metal substrate graphene modified anticorrosive paint comprises epoxy resin, modified graphene, pigment, co-solvent, foam killer, leveling agent, anti-settling agent, dispersant, methylated amino resin and phenol-formaldehyde amine.

XIAO H, XIE Q

Graphene-based PCB copper-clad plate, comprises copper-clad laminate prepreg, copper foil and prepreg, and a layer of chemical vapor deposited graphene between copper foils.

ZHANG J, ZHANG Y, XU Y, FENG S, WANG Q

Silicone epoxy resin composition comprises epoxy-modified silicone oil, bisphenol-A type epoxy resin, epoxy resin curing agent, transparent glass particles, hydrophobic fumed silica and graphene powder.

LIU S

Flame retardant high temperature graphene electrothermal paint comprises graphene filter cake, resin mixture, auxiliary agent and pH adjusting agent.

GAN P

Graphene/epoxy resin composite material comprises graphene, epoxy resin, curing agent and accelerant.

CHEN C, GUO J