国家/地区 中国（17）
IPC部 C（17）
IPC大类 C08（17） B29（5） B32（3）
IPC小类 C08J（17）
IPC C08J005/24（17）
发明人 DU M（3） HUANG H（3） LIU Y（3）
SHI Q（3） WANG G（3） LI L（2）
LUAN J（2） TAN B（2） WANG S（2）
YANG Y（2） ZHANG C（2） ZHANG D（2）
ZHANG M（2） ZHANG S（2）
公开年 2021（13） 2022（4）
申请年 2021（17）
专利权人 SICHUAN EM T.（3） AEROSPACE SP.（2） UNIV JILIN（2）

Conductive high temperature resistant polyimide composite material comprises surface of conductive fabric prefabricated body, whose surface loaded with nano conductive flocking body and conductive polyimide resin system comprises conductive fillers.

ZHANG H, LI L, WANG G, XIN Y, XU X, YIN X, WANG D, KE H, LI N

Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises e.g. dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent, impregnating continuous fibers, then hot-pressing.

ZHAO J, LIU S, WANG Z, YUAN Y

Graphene/SiCnw composite film modified carbon fiber composite material comprises composite preform impregnated with liquid resin and cured to obtain composite material.

ZHOU L, WANG B, ZHANG Y, WANG F

Preparing graphene modified phenolic resin in composite material, involves adding the graphene into the butanol and mixing uniformly to obtain graphene solution, melting phenolic resin to obtain molten phenolic resin.

WEN T, ZHANG B, YUAN H, LIU Y, ZHANG C

Preparing co-cured wave-absorbing composite material comprises paving one layer of first prepreg on forming mold, pre-compacting, paving one layer of second prepreg, covering one layer of absorbing adhesive film on the composite material substrate, covering one layer of third prepreg and curing.

GONG Y, YAN L, LI M, LV T, LI Y

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Preparation method of graphene prepreg for anti-lightning strike, involves using graphene prepreg made of semi-cured resin particles and graphene powder as raw material, mixing by solution, drying, and performing hot-melt compounding process for continuous preparation.

CHEN Y, ZHAO S, LIU Q, ZHANG D, CHEN X

Preparing flexible graphite grounding conductor material comprises e.g. mixing resin, carbon forming agent, conductive material, stirring to form carbon resin, impregnating carbon material with carbon-forming resin, paving, stacking tape.

FAN M, HE H, TAN B, WANG X, TONG X, DAI M, LI Z

High-temperature-resistant epoxy aramid fiber insulation layer and molded parts useful for engineering equipment, i.e., complex materials prepared by hot-pressing layers of high-temperature-resistant epoxy aramid fiber-fabric prepregs.

DU M, HUANG H, SHI Q

Thermal deformation support arm used for controlling space reflector unfolding state, and obtained by blending bidirectional shape memory polymer matrix phase and matrix enhanced phase by physical method.

CHENG Z, JIAO S, CHI D, ZHANG D, LIU Y, GUO X, KANG W