国家/地区 中国（14） 韩国（5） 美国（2）
IPC部 C（17）
IPC大类 C08（17）
IPC小类 C08K（17） F21V（14） F21Y（13）
C08L（12） C09D（5） C09K（5）
F21S（5） F21K（4） C08J（3）
C01B（2）
IPC C08K003/04（17）
发明人 TANG J（2） WANG K（2） YAO L（2）
ZHUANG K（2）
公开年 2018（4） 2016（3） 2017（3） 2021（3） 2022（2）
申请年 2017（4）  2021（3）  2015（2）  2016（2）  2018（2）  2020（2） 
专利权人 SICHUAN YIFE.（2） ZHUANG K（2）

Heat-dissipating coating composition useful for producing LED lighting luminaire, comprises carbon nanotubes, epoxy resin, dispersibility improving copolymer, photoinitiator, and thermally conductive material.

PARK J, KWON Y K

LED heat dissipation lighting light surface treatment composition useful for street lamp case comprises heat dissipation unit made of aluminum which is formed in multiple body portion and radiates heat generated from lighting module.

WOO L, UK L D

Preparing radiating eye-protecting table lamp comprises e.g. preparing base, support, lampshade shell and lampshade cover plate, assembling base, support, lampshade shell, lampshade cover plate and LED lamp assembly, and forming base, support and lampshade shell by injection molding.

WANG K, TANG J, YAO L

Graphene heat dissipation lamp for studying, comprises graphene composite thermally conducting plastic radiator comprising outer thermal conductive layer and inner thermal conductive layer and LED light source board mounted on radiator.

YAO L, TANG J, WANG K, CHEN Z

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Preparing thermal interface material by refluxing graphene and carbon nanotubes in mixed solution of concentrated sulfuric acid and concentrated nitric acid, ball milling obtained powder, adding carbon material to polymer, and stirring.

HE D, LIU Z

Heat dissipating interface material for high-power outdoor lighting light-emitting diode lamps, is prepared by reacting modified graphene, polydimethylsiloxane, paraformaldehyde and bisphenol A.

LI P, YANG C, YANG J, LIU T, YAO C, ZHAO D

Preparing graphene resin composite material used in LED lamp cup, involves mixing graphene powder with resin master batch, plasticizer, stabilizer, lubricant, heating and melting into melt, and carrying out granulating and pelletizing.

SHA Y, SHA X

LED lamp convenient heat-dissipating graphene material includes silicon carbide, graphene oxide, aluminum nitride, boron nitride, itaconic acid dimethyl ester, silicone resin, indium tin oxide, silicon nitride and magnesium sulfate.

WANG J, XU F

Heat dissipation device has base, and heat dissipation elements arranged on base, where heat dissipation channel is arranged between heat dissipation elements and base and dissipation elements are made of graphene composite material.

JIANG G, LU K