国家/地区 世界知识产权组织（23）
IPC部 C（23）
IPC大类 C08（23）
IPC小类 C08K（23） C09D（17） C08L（9）
C08J（6） C09K（6） H01L（5）
C09J（4） B05D（3） B29C（3）
C01B（3） C08G（3） H05K（3）
A01N（2） A61K（2） B22F（2）
IPC C08K003/08（23）
发明人 ZHANG Y（3） BUENDIA J（2） CHAKI N K（2）
HONG X（2） PERRICHON C（2） PICCALUGA P（2）
RAUT R（2） REN L（2） RUSTOGI A（2）
SHAH C P（2） SINGH B（2） SUN R（2）
XU J（2） YE Z（2） ZENG X（2）
公开年 2021（7） 2022（7） 2018（4） 2023（2）
申请年 2020（6）  2021（6）  2018（3）  2022（3）  2017（2）  2019（2） 
专利权人 ALPHA ASSEMB.（2） BUENDIA J（2） PERRICHON C（2） PICCALUGA P（2）
SHENZHEN INS.（2）

Composition in the form of e.g. film, coating, liquid, aerosol, spray, paint, for controlling, preventing and/or reducing concentration of at least one pathogen chosen from e.g. bacteria e.g. Pseudomonas aeruginosa, comprises essential oil, metal species and cationic species.

TAN T, BATRA V, TJANDAPUTRA G, PANCHAI J

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

One-component urethane heat dissipation paint composition e.g. for coating heat dissipation coating film, comprises e.g. polyol, thermally conductive particles including graphite, additives, block diisocyanate and acetate-based solvent.

KIMTAEHAN, HUN L S, YOUK S K, YUMINSOOK, KIM T H, LEE S H, YU M S

Preventing and/or eliminating build-up of scale on conductive surface in contact with aqueous environment comprises coating surface with self-polishing or ablative coating system having at least one layer.

HUANG F

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K

Nanohybrid flame retardant composition useful as flame retardant additives for enhanced fire resistance, comprises metallic nanoparticles composition containing e.g. copper, zinc, silver, gold and antimony, and flame retardant material.

KALITA P, JIANG W

Bonding two substrates for forming bonded assembly by pre-curing thermoset adhesive using radio-frequency energy, where adhesive comprises radio-frequency susceptor, and subjecting thermoset adhesive to heat treatment.

GREEN M, GREUNER J, VASHISTH A, AUVIL T, SOPHIEA D, MASTROIANNI S, GRUNER J, BASIS A, SOPHIA D

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K