国家/地区 中国（10）
IPC部 B（11）
IPC大类 B32（11）
IPC小类 B32B（11）
IPC C08K003/36（11）
发明人
公开年 2022（11）
申请年 2022（7）  2021（3） 
专利权人

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Anti-scale layer used in preparing heat-resistant polyethylene (PE-RT) floor heating pipe, comprises PE-RT, organic silicone masterbatch, nano-silicon dioxide and modified-graphene oxide prepared by modifying graphene oxide with surface modifier.

OU J, CHEN S, CHENG X, QIN X, LV A

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Backboard useful in fields of mobile phone backboard, comprises silicone layer, reinforcement layer and polycarbonate layer arranged in sequence from top to bottom, which has ultra-thin thickness, high strength and stain proof.

LIU W, GAN X, XU X, TAO Y

Ultrathin conductive foam for electronic device, comprises conductive film comprising polymethyl methacrylate, graphene powder, formaldehyde and foam component comprising, vinyl silicone oil, aluminum hydroxide and methyl silicone oil, and adhered to surface of foam component.

JIANG S, ZHANG W

High sealing strong heat-resistant composite film used for packaging food, comprises thermoplastic resin film inner layer comprising heat sealing layer, core layer comprising antioxidant layer and reinforcing layer, and outer layer of heat-resistant film made of nylon 6 composite material.

WU S

Weather-resistant drainage pipeline with multilayer structure, comprises an inner layer, an intermediate layer and an outer layer, where the intermediate layer pipe comprises PVC resin, calcium carbonate powder, calcium-zinc heat stabilizer, solid plasticizer, processing aid and toughening modifier.

HUO F, CHEN H, SONG Q, FENG J

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Processing technology of medicinal composite film based on temperature-sensitive technology comprises e.g. coating adhesive on one side of polyester film layer to form first adhesive layer, compounding polyvinylidene chloride film layer with first adhesive layer, and curing.

ZHOU S, ZHANG C, GU S

Preparing degradable polypropylene copolymer composite board comprises dissolving silicon dioxide and sisal fiber in toluene solution, mixing, heating, introducing nitrogen, adding toluene solution of L-lactide and stannous octoate, and reacting.

WANG Q, ZHONG C, XIANG H