国家/地区 中国（15）
IPC部 C（15）
IPC大类 C08（15）
IPC小类 C08K（15） C08L（13） C09K（12）
C08J（3） C09C（2） C09D（2）
IPC C08K009/02（15）
发明人 CHEN G（2） HUANG H（2） JIANG J（2）
LIN Q（2） LIU Y（2） ZHENG Y（2）
公开年 2017（8） 2018（7）
申请年 2017（15）
专利权人

Graphene-coated composite thermally conductive filler has graphene layer which is made of graphene material, and organic coating layer which is made of resin material, and copper powder layer which is made of flake copper powder material.

ZHENG C, ZHANG H, WANG B

Thermally conductive three-dimensional (3D) graphene-polymer composite material used in electronic device, comprises porous 3D graphene structure comprising network of graphene layers attached to one another and polymer material.

ODEH I N, ZHOU X, MA J, DING S, LIU Y, LIU Z

Preparing high thermal conductive insulating substrate material useful for printed circuit board filled with graphene coated copper powder comprises e.g. dissolving silane coupling agent in ethanol solution to dilute and silicon micropowder.

JIANG L, JIANG J, YING Y, CHEN G, CHEN Q, WEN B, LU B, ZUO G, GAO C

Preparation of composite film used in e.g. instrument packaging bag, by growing polyphenylene diamine on graphene nanoribbon, dispersing in ethylene-vinyl acetate copolymer, adding ethylene-vinyl acetate copolymer pellets and tableting.

ZHENG Y, SU Y, ZHOU J

High thermal conductivity polyimide composite material comprises polyimide resin, modified carbon fiber, carbon nanotubes and graphene.

XIONG P, WANG Y, HUANG H, ZHOU L

Preparing conductive mica used as conductive material, involves mixing white mica with graphene oxide to obtain raw material mixture, adding a reducing agent to raw material mixture, and performing a reduction reaction.

REN F, ZHANG J, ZHANG A, WU K, LIANG M

Modified coating useful for thermal interface material in high power LED, smart device and energy automobile, comprises graphene, carbon nanotube, nano-aluminum oxide, dispersant, silane coupling agent and silicone oil.

MENG Y, LIANG Y, YU W

Graphene-carbon nanotube filled composite board used as substitute of flooring material, contains lignocellulose, silane coupling agent, antioxidant, expandable graphite and modified graphene mixture comprising graphene and carbon.

LU Y

Epoxy resin thermal conductive composite material used in e.g. circuit board, comprises epoxy resin matrix, graphene- modified diamond particles comprising graphene grown on surface of diamond particles, and curing agent.

CHEN G, JIANG J, CHEN D

Thermally conductive polymer composite used in electronic appliances, light-emitting diode, coil ice storage air conditioners, batteries, mobile phones and computers, comprises aerogel body, which is formed from graphene and boron nitride.

AN F, HUANG C, HUANG H, LI W, LI X, QI Y, WANG L, WANG P, WU S, YU Z