国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（7）
IPC小类 C08K（7）
IPC C08K009/06（7）
发明人
公开年 2022（7）
申请年 2022（4）  2021（3） 
专利权人

Modified graphene material useful in thermally conductive composite gasket, comprises graphene and halo-containing silane structural units present on at least part of the surface of the graphene.

HE X, HUANG Y, LI Z, DING K, ZHAO X, WANG X

Composite powder for heat dissipation coating, includes graphene and silicon dioxide microsphere, where graphene and silicon dioxide microsphere are combined together through chemical bond, graphene has preset average transverse size, and silicon dioxide microsphere has preset particle size.

HE P, DING G, ZENG X

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Preparing graphene fiber thermally conductive gasket used in electronic device, comprises modifying graphene fibers with coupling agent, and then mixing with matrix resin and curing agent to prepare.

XIAO W, DU Y, ZHAO L, WANG Z, CAI J

Thermally conductive filler useful for preparing thermally conductive gel, contains mixture of aluminium oxide and graphene oxide, and is modified by silane modifier.

CHEN Q, ZHOU K, LI M, GU Z

Preparing high thermal conductivity composite material comprises e.g. oxidizing graphene and silicon carbide nanowire with hydrogen peroxide to obtain oxidized graphene and oxidized silicon carbide, and reacting graphene oxide and oxidized silicon carbide with silane coupling agent.

ZHOU L, ZHAO F, WANG B, WANG F

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K