国家/地区 中国（11）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08K（12） C08L（12） C09K（9）
C08G（3） C09D（2） F21V（2）
F21Y（2）
IPC C08L063/00（12）
发明人 LIU Y（3） AN D（2） CHEN Y（2）
GUO H（2） LAI C（2） XIA J（2）
XIAO J（2）
公开年 2017（9） 2016（3）
申请年 2016（12）
专利权人 TONGLING TON.（2）

Producing resin reinforced with graphene nanoparticles (GNP) or combination of GNP and carbon nanotubes, used e.g. to make paint, includes e.g. dispersing GNP in monomer mixture of resin and eliminating gases formed under vacuum.

PROLONGO S, TIRADO R, MARTINEZ M, SUAREZ A, ROSARIO HERNANDEZ A, FERNANDEZ A

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Graphene composite polysulfide sealing agent comprises two components, which are polysulphide and vulcanization paste, where polysulphide paste is liquid polysulfide rubber.

QIN P, LIU Y, WU S

High thermal conductivity composite material comprises e.g. silicon carbide, aluminum powder, silicon dioxide, aluminum nitride, polyvinyl butyral, stearic acid, silver particles, dimethyl silicone oil, graphene and lithium hydroxide.

GUO H, AN D, XIA J, XIAO J, LAI C

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X

Aluminum nitride-carbon nanowire composite material for LED, contains silicon carbide, aluminum powder, silicon oxide, yttrium oxide, montmorillonite, curing agent, emulsified silicone oil, stearic acid, polyvinyl butyral and graphene.

GUO H, AN D, XIA J, XIAO J, LAI C

Fiber-based wave-absorbing material comprises epoxy resin matrix, curing agent, graphene fiber and barium ferrite microwave absorber which is uniformly dispersed in epoxy resin where graphene fiber has fiber bundles structure.

MIAO J

Preparing magnesium oxide-graphene composite heat-conducting insulating filler involves adding an aqueous magnesium salt solution to the aqueous solution of graphene oxide and adjusting pH value.

FENG J, CHEN Z, LU Q

Preparing high-molecular matrix/three-dimensional graphite composite material used in integrated circuit, involves dispersing graphene in de-ionized water, adding surfactant, heating mixture and mixing with polymeric substrate.

LI Y, ZHANG H, LIN Y, WANG S, CHEN Y

Preparing carbon nanotubes-oxidized graphene composite material involves ultrasonically dispersing oxidized graphene in water to obtain oxidized graphene dispersion liquid, and adding 2-ethyl-4-methylimidazole to oxidized graphene liquid.

GAO Y, LI J, LI W, LIU Y, MA K, WANG B