国家/地区 中国（25） 世界知识产权组织（2）
IPC部 C（26） B（7） H（6）
IPC大类 C08（26）
IPC小类 C08L（26） C08K（23） C09K（14）
C09D（10） C08J（8） C09J（5）
B29C（3） B32B（3） C01B（3）
H05B（3） H05K（3）
IPC C08L063/00（26）
发明人 CHEN Z（3） LIU R（3） ZHAO Z（3）
LI W（2） LIU H（2） WANG N（2）
公开年 2021（15） 2020（7） 2022（4）
申请年 2020（26）
专利权人 CHEN Z（2） LUOYANG HIGH.（2） LUOYANG JIAN.（2）

Preparing graphene-based wave absorbing honeycomb useful is in radar stealth material comprises mixing tubular graphene, alicyclic epoxy resin and organic solvent, grinding, coating obtained tubular graphene/alicyclic epoxy resin to honeycomb core hole wall and drying.

YANG R, ZHAO Z, LIU R

Wave-absorbing coating composition for wave-absorbing material, comprises resin components, wave absorbing agent, curing agent, calcium brominated lignosulfonate, solvent and auxiliary agent.

WANG K, ZHAO Z, LIU R

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Preparing absorbing glass microbeads comprises filling wave absorbing material in capsule to obtain capsule wave absorbing material, mixing capsule wave absorbing material, resin and curing agent to form coating and coating on hollow glass microspheres and curing.

LI X, LIN Y, ZHAO Z, LIU R

Manufacture of fluorescent epoxy transparent wood involves treating wood with treatment solution containing sulfite and treatment solution comprising hydrogen peroxide, impregnating with epoxy resin composition comprising quantum dots, and curing composition.

SONG S, LEE C K

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Improving viscosity of sound insulation cotton comprises e.g. stacking anti-aging layer, mixed fiber layer, light metal mesh layer, soft resin layer and elastic layer, applying adhesive, compacting, and absorbing sound insulation cotton.

PAN J, WANG F

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H